Wireless sensor network (WSN) node, typically
equipped with a radio transceiver, a small microcontroller
and a battery, is different from traditional embedded systems
because of its requirement of random deployment, small size
and low power consumption. Based on these reasons, miniaturization
of the WSN nodes becomes increasingly crucial
in embedded system design for numerous applications, such
as bio-medical monitoring and body network. In this paper,
several technologies of different packaging levels to achieve
miniaturization and integration are presented, including flip
chip packaging of transceiver and micro-controller bare dies,
embedded capacitance and epoxy based three dimensional integration
technologies. Comparison of the proposed technologies
with the original traditional PCB WSN mote is provided. The
current experiments and measurements are also presented to
show the benefits brought by these technologies not only in
shrinking of the mote size, but also some improvements in
electrical performance such as reduction of parasitic passives. It
is possible to utilizing several different miniaturization technologies
for future miniaturized WSN nodes design. Comparison of
these technologies in WSN application is provided as conclusion
of this paper .