Other

Coughlan, J,Foley, S,Mathewson, A

1997

October

Investigations of stress distributions in tungsten-filled via structures using finite element analysis

Validated

1

()

The effect of thermal-mechanical stresses ina multilevel metallization structure was investigated for different inter metal dielectric materials, via plug-fill technologies and material properties using Finite Element Analysis. Results indicate the presence of large stresses and stress gradients at the metal interfaces which could lead to delamination failures and have a detrimental effect on the electromigration performance of an interconnect system. Results also show that the magnitude of the stresses and stress gradients can be reduced by varying the mechanical properties of the IMD materials. (C) 1997 Published by Elsevier Science Ltd.

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