Peer-Reviewed Journal Details
Mandatory Fields
Miranda, E, Martin-Martinez, J, O'Connor, E, Hughes, G, Casey, P, Cherkaoui, K, Monaghan, S, Long, R, O'Connell, D, Hurley, PK
2009
May
Microelectronics Reliability
Effects of the electrical stress on the conduction characteristics of metal gate/MgO/InP stacks
Published
()
Optional Fields
SOFT BREAKDOWN OXIDE RELIABILITY THICKNESS OPERATION MODEL
49
9-11
1052
1055

The degradation dynamics and post-breakdown current-voltage (I-V) characteristics of magnesium oxide (MgO) layers grown on n and p-type indium phosphide (InP) substrates subjected to electrical stress were investigated. We show that the current-time (I-t) characteristics during degradation can be described by a power-law model I(t) - I(0)t(-alpha). where I-0 and alpha are constants. It is reported that the leakage current associated with the soft breakdown (SBD) failure mode follows the typical voltage dependence I = aV(b), where a and b are constants, for both injection polarities but in a wider voltage range compared with the SiO2/Si system. It is also shown that the hard breakdown (HBD) current is remarkably high, involving large ON-OFF fluctuations that resemble the phenomenon of resistive switching previously observed in a wide variety of metal oxides.

DOI 10.1016/j.microrel.2009.06.017
Grant Details