Peer-Reviewed Journal Details
Mandatory Fields
O'Riordan, A.,Redmond, G.,Dean, T.,Pez, M.
2003
January
Materials Science & Engineering C-Biomimetic and Supramolecular Systems
Field-configured self-assembly: manufacturing at the mesoscale
Validated
()
Optional Fields
23
1-21-2
3
63
We describe a new method, Field-Configured Assembly (FCA), which enables programmed heterogeneous integration of functional mesoscale devices at technologically relevant substrates. To highlight the potential of this new mesoscale manufacturing method, we show that 50-mum-diameter GaAs-based light-emitting diode devices may be successfully manipulated in a high throughput, tweezer-less manner and assembled at selected receptor electrode sites patterned onto an electronically addressable silicon chip. Following assembly, devices may be permanently integrated on-chip by solder reflow bonding to enable direct and reliable electrical interfacing. (C) 2002 Elsevier Science B.V. All rights reserved.We describe a new method, Field-Configured Assembly (FCA), which enables programmed heterogeneous integration of functional mesoscale devices at technologically relevant substrates. To highlight the potential of this new mesoscale manufacturing method, we show that 50-mum-diameter GaAs-based light-emitting diode devices may be successfully manipulated in a high throughput, tweezer-less manner and assembled at selected receptor electrode sites patterned onto an electronically addressable silicon chip. Following assembly, devices may be permanently integrated on-chip by solder reflow bonding to enable direct and reliable electrical interfacing. (C) 2002 Elsevier Science B.V. All rights reserved.
0928-49310928-4931
://WOS:000180600800002://WOS:000180600800002
Grant Details