Peer-Reviewed Journal Details
Mandatory Fields
Riza, Nabeel A.,Sheikh, Mumtaz,Perez, Frank
2007
January
Optics Communications
Optical substrate thickness measurement system using hybrid fiber-freespace optics and selective wavelength interferometry
Validated
()
Optional Fields
269
11
24
2924
Proposed and demonstrated is a simple few components non-contact thickness measurement system for optical quality semi-transparent samples such as Silicon (Si) and 6H Silicon Carbide (SiC) optical chips used for designing sensors. The instrument exploits a hybrid fiber-freespace optical design that enables self-calibrating measurements via the use of confocal imaging via single mode fiber-optics and a self-imaging type optical fiber collimating lens. Data acquisition for fault-tolerant measurements is accomplished via a sufficiently broadband optical source and a tunable laser and relevant wavelength discriminating optics. Accurate sample thickness processing is achieved using the known material dispersion-data for the sample and the few (e.g., 5) accurately measured optical power null wavelengths produced via the sample etalon effect. Thicknesses of 281.1 mu m and 296 mu m are measured for given SiC and Si optical chips, respectively. (c) 2006 Elsevier B.V. All rights reserved.Proposed and demonstrated is a simple few components non-contact thickness measurement system for optical quality semi-transparent samples such as Silicon (Si) and 6H Silicon Carbide (SiC) optical chips used for designing sensors. The instrument exploits a hybrid fiber-freespace optical design that enables self-calibrating measurements via the use of confocal imaging via single mode fiber-optics and a self-imaging type optical fiber collimating lens. Data acquisition for fault-tolerant measurements is accomplished via a sufficiently broadband optical source and a tunable laser and relevant wavelength discriminating optics. Accurate sample thickness processing is achieved using the known material dispersion-data for the sample and the few (e.g., 5) accurately measured optical power null wavelengths produced via the sample etalon effect. Thicknesses of 281.1 mu m and 296 mu m are measured for given SiC and Si optical chips, respectively. (c) 2006 Elsevier B.V. All rights reserved.
0030-40180030-4018
://WOS:000242671000004://WOS:000242671000004
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