Smet, Vanessa and Jamal, Mamun and Waldron, Finbarr and Stam, Frank and Mathewson, Alan and Razeeb, Kafil M

2013

January

IEEE Transactions On Components and Packaging Technologies

High-Temperature Die-Attach Technology for Power Devices Based on Thermocompression Bonding of Thin Ag Films

Validated

()

3

4

533

542