Conference Publication Details
Mandatory Fields
Mathewson, A and Brun, J and Ponthenier, G and Franiatte, R and Nowodzinski, A and Sillon, N and Poupon, G and Deputot, F and Dubois-Bonvalot, B
Electronic Components and Technology Conference, 2007. ECTC'07. Proceedings. 57th
Detailed characterisation of Ni microinsert technology for flip chip die on wafer attachment
2007
January
Validated
()
Optional Fields
616
621
Grant Details