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Mandatory Fields

Authors

Mathewson, Alan and Montes De Oca, Carlos Gonzales and Foley, Sean

Year

2001

Month

January

Journal

Microelectronics Reliability

Title

Thermomechanical stress analysis of Cu/low-< i> k dielectric interconnect schemes

Status

Validated

Peer Reviewed

Optional Fields

Keywords

Volume

41

Issue

9

Start Page

1637

End Page

1641

Abstract

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Publisher

ISBN / ISSN

Edition

URL

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