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Authors

Coughlan, J and Foley, S and Mathewson, A

Year

1997

Month

January

Journal

Microelectronics Reliability

Title

Investigations of stress distributions in tungsten-filled via structures using finite element analysis

Status

Validated

Peer Reviewed

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Keywords

Volume

37

Issue

10

Start Page

1549

End Page

1552

Abstract

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Publisher

ISBN / ISSN

Edition

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