Peer-Reviewed Journal Details

Mandatory Fields

Authors

Jesudoss, Pio and Mathewson, Alan and Wright, William and O'Flynn, Brendan and Stam, Frank

Year

2008

Month

January

Journal

Title

Effect of solder volume on joint shape with variable chip-to-board contact pad ratio

Status

Validated

Times Cited

()

Optional Fields

Keywords

Volume

Issue

Start Page

End Page

Abstract

Publisher Location

ISBN / ISSN

Edition

URL

DOI Link

Grant Details

Funding Body

Grant Details