Conference Publication Details
Mandatory Fields
Mathewson, A and Brun, J and Franiatte, R and Nowodzinski, A and Sillon, N and Depoutot, F and Dubois-Bonvalot, B
Electronics Packaging Technology Conference, 2007. EPTC 2007. 9th
Reliability Aspects of Microinsert Based Interconnection Technologies
2007
January
Validated
()
Optional Fields
227
232
Grant Details