Conference Publication Details
Mandatory Fields
Vuorela, M and Holloway, M and Fuchs, S and Stam, F and Kivilahti, J
Adhesive Joining and Coating Technology in Electronics Manufacturing, 2000. Proceedings. 4th International Conference on
Bismuth-filled anisotropically conductive adhesive for flip chip bonding
2000
January
Validated
()
Optional Fields
147
152
Grant Details