Foley, S,Motyneaux, J,Mathewson, A,IEEE,IEEE

Evaluation of test methods and associated test structures for interconnect reliability control

ICMTS 1999: PROCEEDINGS OF THE 1999 INTERNATIONAL CONFERENCE ON MICROELECTRONIC TEST STRUCTURES

1999

Validated

1

()

167

172

A number of fast wafer level test methods exist for interconnect reliability evaluation. The relative abilities of three such methods to predict the quality and reliability of the interconnect over very short test times are evaluated in this work. Four different test structure designs are also evaluated and the results are compared with package level Median Time to Failure (MTF) results. The Isothermal test method combined with SWEAT-type test structures is shown to be the most suitable combination for interconnect reliability detection and control over very short test times.