Conference Publication Details
Mandatory Fields
Jesudoss, P. Mathewson, A; Wright, W; O'Flynn, B; Stam, F;
Proc. XXXII International Microelectronics and Packaging IMAPS-IEEE CPMT Poland Conference (IMAPS-CPMT 2008)
Effect of Solder Volume on joint shape with variable chip-to-board contact pad ratio
2008
January
Validated
1
()
Optional Fields
21-SEP-08
24-SEP-08
Grant Details