Mandatory Fields

Authors

Jesudoss, P.; Mathewson, A.; Wright, W. ; O'Flynn, B.; Stam, F.;

Conference Title

32nd International Microelectronics and Packaging IMAPS-CPMT Poland Conference

Title of Paper

Effect of solder volume on joint shape with variable chip-to-board contact pad ratio

Year

2008

Month

September

Status

Published

Peer Reviewed

Times Cited

()

Optional Fields

Keywords

Editors

IMAPS

Start Page

In press

End Page

In press

Location

Warszawa-Pultusk, Poland

Start Date

21-SEP-08

End Date

24-SEP-08

Abstract

Funded By

URL

DOI Link

Grant Details

Funding Body

Grant Details