Conference Publication Details
Mandatory Fields
STAM, F;OGRADY, P;BARRETT, J
JOURNAL OF ELECTRONICS MANUFACTURING
CHARACTERIZATION AND RELIABILITY STUDY OF ANISOTROPIC CONDUCTIVE ADHESIVES FOR FINE-PITCH PACKAGE ASSEMBLY
1995
March
Validated
1
WOS: 8 ()
Optional Fields
1
8
The application of Anisotropic Conductive Adhesive (ACA) for the interconnection of fine pitch Surface Mount Devices (SMDs) to electroless nickel/gold plated copper clad FR4 board was investigated. One ACA tape, one ACA paste, and one isotropic conductive adhesive paste were used in a Taguchi (L9) experimental design(1). The experiment was carried out with three different gull-wing leaded, Ceramic Quad Flat Pack (CQFP) packages. The packages were mounted onto FR4 boards using a hot bar (thermode) system with adjustable temperature and pressure setting. Quality and reliability assessment was carried out by visual inspection, mechanical strength testing and electrical resistance measurements of individual leads before and after humidity testing and temperature cycling. The processing issues of conductive paste and tape adhesive assembly compared to solder assembly were examined and valuable information was also obtained from reliability testing. Although mechanical strengths and electrical resistances were obtained similar to those expected for solder assembly; reliability, humidity testing in particular, needs to be addressed in greater detail in order to make the application of ACAs a viable alternative to solder.
Grant Details