Conference Publication Details
Mandatory Fields
Wang, NN;Barry, J;Hannon, J;Kulkarni, S;Foley, R;McCarthy, K;Rodgers, K;Waldron, F;Barry, M;Casey, D;Rohan, J;O'Brian, J;Hegarty, M;Kelleher, AM;Roy, S;Mathuna, CO
2013 IEEE 63RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)
High Frequency dc-dc Converter with Co-packaged Planar Inductor and Power IC
2013
January
Validated
1
WOS: 7 ()
Optional Fields
SILICON
1946
1952
The paper introduces the trend of integration and miniaturization of power converters with potential for enhanced efficiency, form factor reduction and cost reduction. To demonstrate the concept of highly integrated switched mode power supply with integrated magnetic, a system-in-package DC-DC converter using a stacked co-packaging approach is developed. A system approach was taken to the design, and functional integration, using 3-D packaging for realizing a power supply in package solution (PwrSiP). The target integrated converter is capable of handling an input voltage of 5V and frequencies up to 40MHz. A DC-DC converter IC on a 0.35. m CMOS process was designed to meet this goal. In parallel with the IC design, technology development for on-silicon integrated micro-inductors was completed to achieve small-form factor and extremely low profile. A maximum measured efficiency of 83% and 78% was achieved on the stacked converter operating at 20MHz and 40MHz, respectively. The stacked approach showed a 30% area reduction compared to side-by-side implementation with external discrete inductor.
Grant Details