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Authors

Duffy, M;Kulkarni, S;Roy, S;Ng, WM;Hui, R

Conference Title

2012 IEEE ENERGY CONVERSION CONGRESS AND EXPOSITION (ECCE)

Title of Paper

Investigating the scope for electroplated magnetic alloys in shielding of PCBs

Year

2012

Month

January

Status

Validated

Peer Reviewed

Times Cited

()

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Editors

Start Page

401

End Page

406

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Start Date

End Date

Abstract

Electroplated magnetic alloys have previously been proposed as suitable shielding materials in wireless power systems with PCB coils. Detailed analysis of the performance of one such alloy (Ni50Fe50) is presented in terms of coil impedance, core loss and shielding effectiveness. Eddy-current effects are shown to dominate performance at high frequency, with thinner magnetic layers providing the best solution.

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