Liu, L;Loi, R;Roycroft, B;O'Callaghan, J;Trindade, AJ;Kelleher, S;Gocalinska, A;Thomas, K;Pelucchi, E;Bower, CA;Corbett, B

2019

February

Journal of Physics D: Applied Physics

Low-power-consumption optical interconnect on silicon by transfer-printing for used in opto-isolators

Validated

WOS: 4 ()

QUANTUM-DOT LASERS ON-CHIP INTEGRATION

52

On-chip optical interconnects heterogeneously integrated on silicon wafers by transfer-print technology are presented for the first time. Thin (<5 mu m), micron sized light-emitting diodes (LEDs) and photo diodes (PDs) are prefabricated and transfer-printed to silicon wafer with polymer waveguides built between them. Data transmission with total power consumption as low as 1 mW, signal to noise ratio of >250 and current transfer ratio of 0.1% in a compact volume of <0.0004mm(3) are demonstrated. Experiment shows that the polymer waveguide between the LED and PD plays a key role in enhancing the data transmission efficiency. Reciprocal performance for bidirectional transmission is also achieved. The results show the potential for cost-effective and low profile form-factor on-chip opto-isolators.

BRISTOL

0022-3727

10.1088/1361-6463/aaf064