Peer-Reviewed Journal Details
Mandatory Fields
McCloskey P.;Jamieson B.;O'Donnell T.;Gardner D.;Morris M.;Roy S.
2010
May
Journal of Magnetism and Magnetic Materials
Electrodeposited amorphous Co-P based alloy with improved thermal stability
Validated
Scopus: 5 ()
Optional Fields
Co-P High frequency soft magnetic material Integrated inductor Multi-nano-layer Thermal stability
322
9-12
1536
1539
As result of its high resistivity and good magnetic properties, electrodeposited amorphous Co-P (a-Co-P) is an attractive material for use in the integration of on-chip inductors into silicon process technology. However as an amorphous material, the properties of a-Co-P are dramatically changed upon crystallization. This paper reports a novel electrodeposited magnetic alloy, a-Co-P-Re that shows a significantly improved thermal performance in comparison to a-Co-P, retaining coercivity, Hc<92 A/m after a thermal anneal at 298 C. These results were obtained for alloys with a composition of; Co 100-x-y, Px, Rey where; 9.7 at%
0304-8853
10.1016/j.jmmm.2009.07.059
Grant Details