As component and power densities have increased, printed circuit boards (PCBs) have
taken on additional functionality including heatsinking and forming constituent parts
of electrical components. PCBs are not well suited to these tasks. A novel fabrication
method is proposed to develop an enhanced circuit board fabrication approach which
overcomes this problem. This method uses a photoresistive scaffold and subsequent
metallization to realize the proposed structures. These structures are suitable as
heatsinks, inductor windings, busbars and EMI shields among other applications.